XJS-801A SMD Adhesive
Introduction
The XJS-801A SMD Adhesive is a high-performance epoxy glue designed specifically for Surface Mount Technology (SMT) applications. It ensures reliable bonding of SMD components to printed circuit boards during the assembly process. With excellent heat resistance, fast curing, and strong adhesive strength, it is the ideal solution for modern PCB manufacturing.
Features:
- High Bond Strength – Ensures stable fixing of SMD components during reflow soldering.
- Fast Curing – Cures in just 90 seconds at 150°C, improving production efficiency.
- Reliable Performance – Prevents component shifting, dropping, or soldering defects.
- Optimized for SMT Lines – Compatible with high-speed dispensing equipment.
- Extended Shelf Life – Up to 6 months storage at -2~8°C, ensuring long-term usability.
Technical Advantages
- Cost Effective – Low operating cost with proven Sn/Pb reliability
- Easy to Use – Minimal change required to existing production process
- Stable Performance – Excellent printability and solder joint strength
Applications
- Fixing SMD components during reflow soldering
- Preventing displacement and soldering defects
- Ideal for LED assembly, PCB manufacturing, and SMT production lines
Technical Specifications:
| Specification | Details |
|---|---|
| Model | XJS-801A |
| Type | Epoxy Glue |
| Net Weight | 200g |
| Curing Time | 90 sec (at 150°C) |
| Shelf Life | 6 months (-2~8°C) |
At XJS Electronics, we are committed to delivering cutting-edge SMT solutions and high-quality soldering materials. With years of expertise in electronics manufacturing, we provide solder pastes, adhesives, wave soldering machines, reflow ovens, PCB handling equipment, and automation solutions.
Our products are trusted by global clients for their quality, durability, and cost-effectiveness.
